Abstract
(Englisch)
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We will develop an optical interconnect family for a high data rate, 2D array optical interconnect between ICs, applicable at the IC-access, board level and at the board-to-board level. The technology will be applied to high-end IP-router systems. Architectural studies will be performed in order to address future challenges in high performance, high bandwidth systems. 2D VCSEL and photodetector arrays and their respective analogue CMOS circuit interfaces will be designed, prototyped and assessed. The optical interface to the digital chip will be established by directly flip-chip mounting the opto-arrays on top of the CMOS, thus circumventing the chip access bottleneck. Suitable packaging methods for this assembly will be developed. PCB integrable guided wave optical waveguides (plastic optical fibre, glass sheet waveguides) will be investigated.
Objectives:
We will develop an optical interconnect family for a high data rate, 2D array optical interconnect between ICs, applicable at the IC-access, board level and at the board-to-board level. The approach is based on optical waveguides that are integrable with printed circuit boards, either as a post-solder build-up extension or as a solder-compatible optical layer. The optical waveguides will be based on novel Plastic Optical Fibres, and on advanced layered Glass Sheets with waveguides.
Key target parameters aimed for are: channel density from 16/mm[2] (first generation) to 64/mm[2], number of channels (at optical interfaces) ranging from 64 (first generation), to 256, data rate between 1.25 Gb/s and 2.5 Gb/s or higher. We will demonstrate a complete optical interconnect technology family in a major application area, being that of core IP routers.
Work description:
The key objectives of the project are to develop an optical interconnect technology family for two-dimensional high bandwidth interconnect between ICs and to demonstrate the viability of this family in a major application area, being that of core IP routers. For this to be feasible, the contributions of all partners are important. Alcatel Bell will analyse the current and future high-performance IP routers and pinpoint the exact nature of the bottlenecks and the places where they occur in the systems. The results of this study will then be used to set the specifications and define the design for the demonstrator implementing core IP router functionality. These specifications will have an impact on the design of the light sources (designed and manufactured by Avalon Photonics), the design of the driver and receiver circuits (by Helix) and the development of detector arrays (by Opto Speed). The specifications will also have a large impact on the design of the optical pathway (POF fibre ribbons produced by Alcatel Cable, micro-wiring POF flex-print of RCI, glass sheets from PPC Electronics, connectors and optical pathway interface blocks by FCI and IMEC) and its integration in or on the board or backplane. To reduce the initial effort of introducing opto-electronic components for future applications, the project will also put significant effort into setting up a design flow that takes opto-electronic components into account. Therefore, IMEC will contribute to set up a design methodology and integrate specifications and implementation of opto-electronic components into current (electronic) EDA (Electronic Design Automation) tools. This design methodology will also be used for the design and implementation of the core IP router demonstrator.
Milestones:
The project will lead to the following outcome:
1. A design methodology for the introduction of optical interconnect in high-end electronic systems;
2. A family of components and technologies that allow for the implementation of optical interconnect at the IC-access, board, connector and backplane level; both a ribbon-like solution for early introduction as well as a more integrated board build-on solutions;
3. The application of those methods and technologies in a core IP-core router system.
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