FLAME: Flexible laser assisted micro-engineering

• Research unit: EU RFP
• Project number: 00.0486

Key words (English)

Ormocer; micro-optics; laser-machining; VCSEL; Economic Aspects; Environmental Protection; Industrial Manufacture; Innovation; Technology Transfer; Safety

Alternative project number (English)

EU project number: G1RD-2000-00297

Research programs (English)

EU-programme: 5. Frame Research Programme - 1.3.1 Innovative products, processes and organization

Short description (English)

See abstract

Partners and International Organizations (English)

Coordinator: Exitech Ltd (UK)

Abstract (English)

The aim of the project FLAME is to build a laser-based MST (micro-systems technology) prototyping tool. Because of its greater flexibility and higher resolution, the machine developed in this project will use the material subtractive process of laser ablation to define the micro-system or subassembly. The capability of the machine will be proven by selective micropatterning of contact pads, vias etc. in replicated optical films on substrates such as VCSEL wafers (VCSEL + Micro-Optics). Rapid prototyping will be demonstrated by combining laser machined mechanical features and replicated optical structures to form hybrid Microsystems.
CSEM, as one of the end-users of the project partners, has contributed to the definition of the specifications of the machine to be built, safety and ergonomic aspects of machine hard-ware design and process development for devices and demonstrators.
According to the project outline the following work has been carried out:
§ Replicated test samples have been fabricated for initial machining tests on selected materials. The ablation parameters of ORMOCERs and Polymers have been investigated. Machined structures showed required tolerances although ablation control can still be improved.
§ First laser machining tests of a plastic film conductor, which is used for OLED devices, have been carried out. Initial work has shown that the selective removal of the ITO layer without damaging the underlying layers requires a very high degree of ablation control.
§ Four different device structures have been selected to build the final demonstrators:
o Reliability enhancement and dicing of full wafer replicated elements
o defining of dicing channels and opening of vias for bonding on VCSEL chips with replicated micro-optical elements
o direct machining of micro-mechanical features for alignment and assembly purposes
o direct writing of electrode patters on plastic film conductors.
First machining tests on relevant materials indicate the suitability of the laser machine to manufacture the planned demonstrators and to develop commercial devices. Further improvement of the process is ongoing.

References in databases (English)

Swiss Database: Euro-DB of the
State Secretariat for Education and Research
Hallwylstrasse 4
CH-3003 Berne, Switzerland
Tel. [phone]
Swiss Project-Number: 00.0486