Fast Reliable Fine-Pitch Wire Bonding by Feed-Back from Integrated Microsensors

Research unit

INNOSUISSE

Project number

4561.2;7 KTS-NM

Project title

Fast Reliable Fine-Pitch Wire Bonding by Feed-Back from Integrated Microsensors

Texts for this project

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Short description (German)	Fast Reliable Fine-Pitch Wire Bonding by Feed-Back from Integrated Microsensors