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Research unit
INNOSUISSE
Project number
35471.1 INNO-ENG
Project title
Bonding technologies for contactless die attach process
Project status Finished
 
Start date 17.01.2019
End date 17.01.2021
 
Granted total costs 15'000.00  CHF
Section 70 Engineering
Project category Project
Research type Applied research and development
NABS classification Industrial production and technology
 
Research disciplines
100 % P265 Semiconductory physics

Last modification of the project