Titre du projet
Development of novel microfoams with reduced compressibility for viscoelastic sealing, bonding and adhesive materials by tailored dispering and interfacial pickering stabilization (PICMICS)
Titre du projet anglais
Development of novel microfoams with reduced compressibility for viscoelastic sealing, bonding and adhesive materials by tailored dispering and interfacial pickering stabilization (PICMICS)