Feasibility study on hermetic implantable interface chips for neurostimulation (NeuroPack)

• Unité de recherche: INNOSUISSE
• Numéro de projet: 10763.1;3 PFLS-LS
• Titre du projet anglais: Feasibility study on hermetic implantable interface chips for neurostimulation (NeuroPack)

Description succincte (Anglais)

Feasibility study on hermetic implantable interface chips for neurostimulation (NeuroPack)

Résumé des résultats (Abstract) (Anglais)

Modern active medical implants are constrained in application by technology. Lifting this constraint requires radically new platform technologies for tissue interface, device packaging, and system architectures. In this feasibility study, the possibility for hermetically sealed implantable chips based on the use of biocompatible materials is evaluated.